About the role
Employer: Annapurna Labs (U.S.) Inc.Position: ASIC III - AMZ27336.4Location: Austin, TXMultiple Positions Available:Engage in definition, design and validation of AWS next generation ML Chips, Cards and Employer: Annapurna Labs (U.S.) Inc.Position: ASIC III - AMZ27336.4Location: Austin, TXMultiple Positions Available:Engage in definition, design and validation of AWS next generation ML Chips, Cards and server integration. • Participate in the design and execution of all HBM, Memories and Serdes topics, with the goal of creating and customized platforms that fit within AWS datacenter’s world leading technology. • Work with vendors, understand the settings, write/modify tests, debug and collect data in the fleet • Participate in the code review process, design discussions, team planning, and ticket/metric/COE reviews • Collaborate with architects, design teams, software engineers to deliver the next generation ML chip. • Responsible for IP integration, 2.5D design, bring up, Characterization and validation. • Focus on operational excellence, constructively identifying problems and proposing solutions.(40 hours / week, 8:00am-5:00pm, Salary Range $202779 - $215300)Amazon.com is an Equal Opportunity – Affirmative Action Employer – Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation#0000 A Master’s degree or foreign equivalent in Computer Science, Computer Engineering, Electronics Engineering, or a related field and 5 years of experience in the job offered or a relatedoccupation. In the alternative, a Bachelor’s degree or foreign equivalent in Computer Science, Computer Engineering, Electronics Engineering or a related field followed by 7 years ofprogressively responsible post-baccalaureate experience in the job offered or a related occupation.Must have 3 years of experience in the following:1) SOC/IO/Subsystems.2) DDR/HBM at the PHY and controller level and DDR/HBM training, timing parameters and/or controller features.3) Driving the IP Integration and designing silicon and 2.5D packaging.4) Supporting the physical design team, reviewing clocking and timing constraints5) Driving cross-functional triage effort on complex functional and performance issues.6) Taking the leadership role in post-silicon bring-up of IO and HBM/DRRx stack.7) Defining boot-up initialization, reset flow, training sequence.8) Performing system-level debug and root-cause analysis through bringup, characterization, validation and production phase.9) Working with 3rd party IP and memory vendors#0000 All applicants must meet all the above listed requirements.Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.